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AFE1124E 参数 Datasheet PDF下载

AFE1124E图片预览
型号: AFE1124E
PDF下载: 下载PDF文件 查看货源
内容描述: HDSL / MDSL模拟前端 [HDSL/MDSL ANALOG FRONT END]
分类和应用:
文件页数/大小: 11 页 / 162 K
品牌: BURR-BROWN [ BURR-BROWN CORPORATION ]
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PIN CONFIGURATION
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING
NUMBER
(1)
324
TEMPERATURE
RANGE
–40 to +85
PRODUCT
PACKAGE
28-Pin SSOP
NC
NC
DV
DD
DGND
txbaudCLK
tx48xCLK
Data In
rxbaudCLK
rx48xCLK
Data Out
DV
DD
DGND
AV
DD
rxHYB–
1
2
3
4
5
6
7
AFE1124
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
NC
AGND
txLINE+
AV
DD
txLIKNE–
AGND
AV
DD
vrREFN
VCM
vrREFP
AGND
rxLINE+
rxLINE–
rxHYB+
AFE1124E
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ABSOLUTE MAXIMUM RATINGS
Analog Inputs: Current ..............................................
±100mA,
Momentary
±10mA,
Continuous
Voltage .................................. AGND –0.3V to AV
DD
+0.3V
Analog Outputs Short Circuit to Ground (+25°C) ..................... Continuous
AV
DD
to AGND ........................................................................ –0.3V to 6V
DV
DD
to DGND ........................................................................ –0.3V to 6V
Digital Input Voltage to DGND .................................. –0.3V to DV
DD
+0.3V
Digital Output Voltage to DGND ............................... –0.3V to DV
DD
+0.3V
AGND, DGND, Differential Voltage ..................................................... 0.3V
Junction Temperature (T
J
) ............................................................. +150°C
Storage Temperature Range .......................................... –40°C to +125°C
Lead Temperature (soldering, 3s) .................................................. +260°C
Power Dissipation .......................................................................... 700mW
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN
assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject
to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not
authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
®
3
AFE1124