NAND01G-B2B, NAND02G-B2C
Package mechanical
12
Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second level interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
Figure 35. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package outline
1
48
e
D1
B
L1
24
25
A2
A
E1
E
A1
α
L
DIE
C
CP
TSOP-G
1. Drawing is not to scale.
Table 26. TSOP48 - 48 lead plastic thin small outline, 12 x 20 mm, package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
B
1.20
0.15
1.05
0.27
0.21
0.08
12.10
20.20
18.50
–
0.047
0.006
0.041
0.011
0.008
0.003
0.476
0.795
0.728
0.10
1.00
0.22
0.05
0.95
0.17
0.10
0.004
0.039
0.009
0.002
0.037
0.007
0.004
C
CP
D1
E
12.00
20.00
18.40
0.50
0.60
0.80
3°
11.90
19.80
18.30
–
0.472
0.787
0.724
0.020
0.024
0.031
3°
0.468
0.779
0.720
–
E1
e
L
0.50
0.70
0.020
0.028
5°
L1
α
0°
5°
0°
55/60
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