NAND01G-B2B, NAND02G-B2C
Package mechanical
Figure 37. VFBGA63 9 x 11 mm - 6 x 8 active ball array, 0.80 mm pitch, package outline
D
D2
D1
FD1
FE
e
SE
b
E
E2 E1
ddd
BALL "A1"
FE1
A
A2
e
SD
FD
A1
BGA-Z75
1. Drawing is not to scale
Table 28. VFBGA63 9 x 11 mm - 6 x 8 active ball array, 0.80 mm pitch, package mechanical data
millimeters
Min
inches
Min
Symbol
Typ
Max
Typ
Max
A
A1
A2
b
1.05
0.041
0.25
0.010
0.70
0.50
9.10
0.028
0.020
0.358
0.45
9.00
4.00
7.20
0.40
8.90
0.018
0.354
0.157
0.283
0.016
0.350
D
D1
D2
ddd
E
0.10
0.004
0.437
11.00
5.60
8.80
0.80
2.50
0.90
2.70
1.10
0.40
0.40
10.90
–
11.10
0.433
0.220
0.346
0.031
0.098
0.035
0.106
0.043
0.016
0.016
0.429
–
E1
E2
e
–
–
FD
FD1
FE
FE1
SD
SE
–
–
–
–
–
–
–
–
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