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ADC12D1600 参数 Datasheet PDF下载

ADC12D1600图片预览
型号: ADC12D1600
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内容描述: ADC12D1000 / ADC12D1600 12位, 2.0 / 3.2 GSPS超高速ADC [ADC12D1000/ADC12D1600 12-Bit, 2.0/3.2 GSPS Ultra High-Speed ADC]
分类和应用:
文件页数/大小: 73 页 / 1626 K
品牌: TI [ TEXAS INSTRUMENTS ]
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SNAS480M – MAY 2010 – REVISED MARCH 2013
ADC12D1000/ADC12D1600 12-Bit, 2.0/3.2 GSPS Ultra High-Speed ADC
Check for Samples:
1
FEATURES
Configurable to Either 2.0/3.2 GSPS
Interleaved or 1.0/1.6 GSPS Dual ADC
Pin-compatible with ADC10D1x00 and
ADC12D1x00
Internally Terminated, Buffered, Differential
Analog Inputs
Interleaved Timing Automatic and Manual
Skew Adjust
Test Patterns at Output for System Debug
Programmable 15-bit Gain and 12-bit Plus Sign
Offset
Programmable t
AD
Adjust Feature
1:1 Non-demuxed or 1:2 Demuxed LVDS
Outputs
AutoSync Feature for Multi-chip Systems
Single 1.9V ± 0.1V Power Supply
KEY SPECIFICATIONS
Resolution: 12 Bits
Interleaved 2.0/3.2 GSPS ADC
– Noise Floor: -152.6/-153.6 dBm/Hz (typ)
– IMD3: -66/-63 dBFS (typ)
– Noise Power Ratio: 49.5/48.5 dB (typ)
– Power: 3.38/3.88 W (typ)
– Full Power Bandwidth: 1.75/1.75 GHz (typ)
Dual 1.0/1.6 GSPS ADC, Fin = 125 MHz
– ENOB: 9.6/9.4 Bits (typ)
– SNR: 60.2/58.5 dB (typ)
– Power: 3.38/3.88W (typ)
– Full Power Bandwidth: 2.8/2.8GHz (typ)
2
DESCRIPTION
The 12-bit, 2.0/3.2 GSPS ADC12D1000/1600 is the
latest advance in TI's Ultra High-Speed ADC family
and builds upon the features, architecture and
functionality of the 10-bit GHz family of ADCs.
The ADC12D1000/1600 provides a flexible LVDS
interface which has multiple SPI programmable
options to facilitate board design and FPGA/ASIC
data capture. The LVDS outputs are compatible with
IEEE 1596.3-1996 and support programmable
common mode voltage.
The ADC12D1000/1600 is packaged in a leaded or
lead-free 292-ball thermally enhanced BGA package
over the rated industrial temperature range of -40°C
to +85°C.
APPLICATIONS
Wideband Communications
Data Acquisition Systems
RADAR/LIDAR
Set-top Box
Consumer RF
Software Defined Radio
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2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
Copyright © 2010–2013, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.