Monolithic Dual P-Channel
Enhancement Mode MOSFET
General Purpose Amplifier
CORPORATION
3N165 / 3N166
FEATURES
ABSOLUTE MAXIMUM RATINGS (Note 1)
(TA = 25oC unless otherwise specified)
Very High Impedance
High Gate Breakdown
Low Capacitance
•
•
Drain-Source or Drain-Gate Voltage (Note 2)
•
3N165. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V
3N166. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
Transient Gate-Source Voltage (Note 3) . . . . . . . . . . . . . ±125
Gate-Gate Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±80V
Drain Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Storage Temperature. . . . . . . . . . . . . . . . . . . -65oC to +200oC
Operating Temperature . . . . . . . . . . . . . . . . . -55oC to +150oC
Lead Temperature (Soldering, 10sec) . . . . . . . . . . . . . +300oC
Power Dissipation
PIN CONFIGURATION
BOTTOM VIEW
TO-99
S
D2
G2
D1
G1
One Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300mW
Both Sides . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 525mW
Total Derating above 25oC. . . . . . . . . . . . . . . . . . 4.2mW/oC
C
NOTE: Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or
any other conditions above those indicated in the operational sections
of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
0180
D2
G2
G1
C
S
D1
2506
ORDERING INFORMATION
DEVICE SCHEMATIC
Part
Package
Temperature Range
-55oC to +150oC
1
7
3N165-66
X3N165-66 Sorted Chips in Carriers
Hermetic TO-99
-55oC to +150oC
3
5
8
4
0190
ELECTRICAL CHARACTERISTICS (TA = 25oC and VBS = 0 unless otherwise specified)
SYMBOL
PARAMETER
MIN
MAX
UNITS
TEST CONDITIONS
IGSSR
Gate Reverse Leakage Current
10
VGS = 40V
GS = -40V
-10
-25
-200
-400
-30
-5
V
IGSSF
Gate Forward Leakage Current
pA
TA = +125oC
IDSS
Drain to Source Leakage Current
Source to Drain Leakage Current
On Drain Current
VDS = -20V
ISDS
VSD = -20V, VDB = 0
VDS = -15V, VGS = -10V
VDS = -15V, ID = -10µA
VDS = VGS, ID = -10µA
ID(on)
-5
-2
-2
mA
V
VGS(th)
VGS(th)
rDS(on)
Gate Source Threshold Voltage
Gate Source Threshold Voltage
Drain Source ON Resistance
-5
VGS = -20V, ID = -100µA
300
ohms