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RFD3055SM 参数 Datasheet PDF下载

RFD3055SM图片预览
型号: RFD3055SM
PDF下载: 下载PDF文件 查看货源
内容描述: 12A , 60V ,额定雪崩, N沟道增强型功率MOSFET ( MegaFETs ) [12A, 60V, Avalanche Rated, N-Channel Enhancement-Mode Power MOSFETs (MegaFETs)]
分类和应用: 晶体晶体管开关
文件页数/大小: 8 页 / 118 K
品牌: HARRIS [ HARRIS CORPORATION ]
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RFD3055, RFD3055SM, RFP3055
Packaging
A
ØP
Q
H
1
D
E
1
45
o
D
1
TERM. 4
E
A
1
TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
INCHES
SYMBOL
A
A
1
b
b
1
c
D
MIN
0.170
0.048
0.030
0.045
0.014
0.590
-
0.395
-
MAX
0.180
0.052
0.034
0.055
0.019
0.610
0.160
0.410
0.030
0.100 TYP
0.200 BSC
0.235
0.100
0.530
0.130
0.149
0.102
0.255
0.110
0.550
0.150
0.153
0.112
MILLIMETERS
MIN
4.32
1.22
0.77
1.15
0.36
14.99
-
10.04
-
MAX
4.57
1.32
0.86
1.39
0.48
15.49
4.06
10.41
0.76
2.54 TYP
5.08 BSC
5.97
2.54
13.47
3.31
3.79
2.60
6.47
2.79
13.97
3.81
3.88
2.84
NOTES
-
-
3, 4
2, 3
2, 3, 4
-
-
-
-
5
5
-
6
-
2
-
-
L
1
b
1
b
c
D
1
E
E
1
e
e
1
J
1
L
60
o
1
2
3
e
e
1
NOTES:
H
1
J
1
L
L
1
ØP
Q
1. These dimensions are within allowable dimensions of Rev. J of
JEDEC TO-220AB outline dated 3-24-87.
2. Lead dimension and finish uncontrolled in L
1
.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder coating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 1 dated 1-93.
TO-251AA
E
H
1
A
A
1
TERM. 4
SEATING
PLANE
3 LEAD JEDEC TO-251AA PLASTIC PACKAGE
INCHES
SYMBOL
A
A
1
b
b
1
MIN
0.086
0.018
0.028
0.033
0.205
0.018
0.270
0.250
MAX
0.094
0.022
0.032
0.040
0.215
0.022
0.290
0.265
MILLIMETERS
MIN
2.19
0.46
0.72
0.84
5.21
0.46
6.86
6.35
MAX
2.38
0.55
0.81
1.01
5.46
0.55
7.36
6.73
NOTES
-
3, 4
3, 4
3
3, 4
3, 4
-
-
5
5
-
6
-
2
b
2
D
b
1
L
1
L
b
2
c
D
b
1
2
3
c
E
e
0.090 TYP
0.180 BSC
0.035
0.040
0.355
0.075
0.045
0.045
0.375
0.090
2.28 TYP
4.57 BSC
0.89
1.02
9.02
1.91
1.14
1.14
9.52
2.28
e
e
1
J
1
e
1
H
1
J
1
L
L
1
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-251AA outline dated 9-88.
2. Solder finish uncontrolled.
3. Dimension (without solder).
4. Add typically 0.0006 inches (0.015mm) for solder coating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 1 dated 1-93.
7