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RFD3055SM 参数 Datasheet PDF下载

RFD3055SM图片预览
型号: RFD3055SM
PDF下载: 下载PDF文件 查看货源
内容描述: 12A , 60V ,额定雪崩, N沟道增强型功率MOSFET ( MegaFETs ) [12A, 60V, Avalanche Rated, N-Channel Enhancement-Mode Power MOSFETs (MegaFETs)]
分类和应用: 晶体晶体管开关
文件页数/大小: 8 页 / 118 K
品牌: HARRIS [ HARRIS CORPORATION ]
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RFD3055, RFD3055SM, RFP3055
Packaging
(Continued)
E
H
1
A
A
1
SEATING
PLANE
D
L2
L
1
1
3
L
TO-252AA
2 LEAD JEDEC TO-252AA PLASTIC PACKAGE
INCHES
SYMBOL
A
A
1
b
b
1
b
2
b
3
c
L
3
MILLIMETERS
MIN
2.19
0.46
0.72
0.84
5.21
4.83
0.46
6.86
6.35
MAX
2.38
0.55
0.81
1.01
5.46
-
0.55
7.36
6.73
NOTES
-
4, 5
4, 5
4
4, 5
2
4, 5
-
-
7
7
-
-
-
3
-
4, 6
2
b
2
MIN
0.086
0.018
0.028
0.033
0.205
0.190
0.018
0.270
0.250
MAX
0.094
0.022
0.032
0.040
0.215
-
0.022
0.290
0.265
b
e
e
1
TERM. 4
b
1
c
J
1
0.265
(6.7)
D
E
e
e
1
H
1
J
1
0.090 TYP
0.180 BSC
0.035
0.040
0.100
0.075
0.025
0.020
0.170
0.045
0.045
0.115
0.090
0.040
-
-
2.28 TYP
4.57 BSC
0.89
1.02
2.54
1.91
0.64
0.51
4.32
1.14
1.14
2.92
2.28
1.01
-
-
b
3
L
4
0.265 (6.7)
L
L
1
L
2
0.070 (1.8)
0.118 (3.0)
BACK VIEW
0.063 (1.6)
0.090 (2.3)
0.090 (2.3)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
0.063 (1.6)
L
3
L
4
NOTES:
1. These dimensions are within allowable dimensions of Rev. B of
JEDEC TO-252AA outline dated 9-88.
2. L
4
and b
3
dimensions establish a minimum mounting surface for
terminal 4.
3. Solder finish uncontrolled.
4. Dimension (without solder).
5. Add typically 0.0006 inches (0.015mm) for solder coating.
6. L
3
is the terminal length for soldering.
7. Position of lead to be measured 0.090 inches (2.28mm) from bottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 2 dated 6-93.
Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the right to make changes in circuit design and/or specifications at
any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris is
believed to be accurate and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other
rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries.
Sales Office Headquarters
For general information regarding Harris Semiconductor and its products, call
1-800-4-HARRIS
UNITED STATES
Harris Semiconductor
P. O. Box 883, Mail Stop 53-210
Melbourne, FL 32902
TEL: 1-800-442-7747
(407) 729-4984
FAX: (407) 729-5321
EUROPE
Harris Semiconductor
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2-724-2111
SOUTH ASIA
Harris Semiconductor H.K. Ltd.
13/F Fourseas Building
208-212 Nathan Road
Tsimshatsui, Kowloon
Hong Kong
TEL: (852) 723-6339
NORTH ASIA
Harris K.K.
Kojimachi-Nakata Bldg. 4F
5-3-5 Kojimachi
Chiyoda-ku, Tokyo 102 Japan
TEL: (81) 3-3265-7571
TEL: (81) 3-3265-7572 (Sales)
S E M I C O N D U C T O R
8