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产品型号RFD8P05SM的Datasheet PDF文件预览

RFD8P05, RFD8P05SM, RFP8P05  
Data Sheet  
July 1999  
File Number 2384.2  
8A, 50V, 0.300 Ohm, P-Channel Power  
MOSFETs  
Features  
• 8A, 50V  
These products are P-Channel power MOSFETs  
manufactured using the MegaFET process. This process,  
which uses feature sizes approaching those of LSI circuits,  
gives optimum utilization of silicon, resulting in outstanding  
performance. They were designed for use in applications  
such as switching regulators, switching converters, motor  
drivers, and relay drivers. These transistors can be operated  
directly from integrated circuits.  
• r  
= 0.300  
DS(ON)  
• UIS SOA Rating Curve  
• SOA is Power Dissipation Limited  
• Nanosecond Switching Speeds  
• Linear Transfer Characteristics  
• High Input Impedance  
Formerly developmental type TA09832.  
• Related Literature  
- TB334 “Guidelines for Soldering Surface Mount  
Components to PC Boards”  
Ordering Information  
PART NUMBER  
PACKAGE  
BRAND  
Symbol  
RFD8P05  
TO-251AA  
D8P05  
D8P05  
D
RFD8P05SM  
RFP8P05  
TO-252AA  
TO-220AB  
RFP8P05  
G
NOTE: When ordering, use the entire part number. Add the suffix 9A  
to obtain the TO-252AA variant in tape and reel, i.e.,  
RFD8P05SM9A.  
S
Packaging  
JEDEC TO-220AB  
JEDEC TO-251AA  
SOURCE  
DRAIN  
GATE  
SOURCE  
DRAIN  
GATE  
DRAIN (FLANGE)  
DRAIN (FLANGE)  
JEDEC TO-252AA  
DRAIN (FLANGE)  
GATE  
SOURCE  
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.  
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999.  
4-112  
RFD8P05, RFD8P05SM, RFP8P05  
o
Absolute Maximum Ratings  
T
= 25 C Unless Otherwise Specified  
C
RFD8P05,  
RFD8P05SM, RFP8P05  
UNITS  
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
-50  
-50  
V
V
DSS  
Drain to Gate Voltage (R  
GS  
= 20KΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V  
DGR  
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
-8  
A
D
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
-20  
A
DM  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
±20  
V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
48  
W
D
o
Dissipation Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
0.27  
W/ C  
Single Pulse Avalanche Energy Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . E  
See Figure 6  
-55 to 175  
AS  
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T  
o
300  
260  
C
C
L
o
pkg  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
o
o
1. T = 25 C to 150 C.  
J
o
Electrical Specifications  
T
= 25 C Unless Otherwise Specified  
C
PARAMETER  
SYMBOL  
TEST CONDITIONS  
= 0V (Figure 9)  
MIN  
TYP MAX UNITS  
Drain to Source Breakdown Voltage  
Gate Threshold Voltage  
BV  
DSS  
I
= 250µA, V  
GS  
-50  
-
-
-
-4  
V
D
V
V
V
V
V
= V , I = 250µA (Figure 8)  
DS  
-2  
-
V
GS(TH)  
GS  
DS  
DS  
GS  
D
Zero Gate Voltage Drain Current  
I
= Rated BV  
, V  
= 0V  
, T = 150 C  
-
1
µA  
µA  
nA  
DSS  
DSS GS  
o
= 0.8 x Rated BV  
-
-
25  
±100  
0.300  
60  
-
DSS  
J
Gate to Source Leakage Current  
I
= ±20V  
-
-
GSS  
Drain to Source On Resistance (Note 2)  
Turn-On Time  
r
I
= 8A, V  
= -10V (Figure 7)  
-
-
DS(ON)  
D
GS  
t
V
V
= -25V, I 4A, R = 9.1, R = 6.25Ω,  
-
-
ns  
ON  
DD  
GS  
D
G
L
= -10V  
Turn-On Delay Time  
Rise Time  
t
-
16  
30  
42  
20  
-
ns  
d(ON)  
t
-
-
ns  
r
Turn-Off Delay Time  
Fall Time  
t
-
-
ns  
d(OFF)  
t
-
-
ns  
f
Turn-Off Time  
t
-
100  
80  
40  
2
ns  
OFF  
Total Gate Charge  
Q
V
V
V
= 0 to -20V  
= 0 to -10V  
= 0 to -2V  
V
= -40V, I = 8A,R = 5Ω,  
-
-
nC  
nC  
nC  
C/W  
C/W  
C/W  
g(TOT)  
GS  
GS  
GS  
DD  
D
L
I
= -0.3mA  
G(REF)  
Gate Charge at -5V  
Q
-
-
g(-10)  
Threshold Gate Charge  
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient  
Q
-
-
g(TH)  
o
o
o
R
-
-
3.125  
100  
62.5  
θJC  
θJA  
R
TO-251AA, TO-252AA  
TO-220AB  
-
-
o
Source to Drain Diode Specifications T = 25 C Unless Otherwise Specified  
C
PARAMETER  
Source to Drain Diode Voltage (Note 2)  
Reverse Recovery Time  
NOTE:  
SYMBOL  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
V
I
I
= -8A  
-
-
-
-
-1.5  
125  
SD  
SD  
t
= -8A, dI /dt = 100A/µs  
SD  
ns  
rr  
SD  
2. Pulse test: pulse width 300µs, Duty Cycle 2%.  
3. Repetitive rating: pulse width is limited by maximum junction temperature.  
4-113  
RFD8P05, RFD8P05SM, RFP8P05  
Typical Performance Curves Unless Otherwise Specified  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
-10  
-8  
-6  
-4  
-2  
0
150  
125  
175  
25  
50  
75  
100  
125  
o
0
25  
50  
75  
100  
175  
150  
o
T , CASE TEMPERATURE ( C)  
C
T
, CASE TEMPERATURE ( C)  
C
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE  
TEMPERATURE  
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs  
CASE TEMPERATURE  
10  
100  
If R = 0  
t
= (L) (I ) / (1.3 RATED BV  
AS  
- V  
DSS DD  
)
AV  
If R 0  
DC OPERATION  
t
= (L/R) ln [(I *R) / (1.3 RATED BV  
AS  
- V ) + 1]  
DD  
AV  
DSS  
OPERATION IN THIS  
AREA IS LIMITED BY r  
I
DM  
10  
o
STARTING T = 25 C  
J
DS(ON)  
o
STARTING T = 150 C  
J
1
o
T
T
= 25 C  
C
J
o
= 175 C  
1
0.1  
-100  
-1  
-10  
, DRAIN TO SOURCE VOLTAGE (V)  
0.1  
1
10  
100  
V
t
, TIME IN AVALANCHE (ms)  
DS  
AV  
FIGURE 3. FORWARD BIAS SAFE OPERATING AREA  
FIGURE 4. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY  
20  
-20  
PULSE DURATION = 80µs  
PULSE DURATION = 80µs  
V
= -10V  
GS  
o
V
= -9V  
25 C  
DUTY CYCLE = 0.5% MAX  
= 15V  
DUTY CYCLE = 0.5% MAX  
GS  
o
V
T
= 25 C  
DD  
C
o
16  
12  
8
-16  
-12  
-8  
175 C  
V
= -8V  
= -7V  
GS  
o
-55 C  
V
GS  
V
= -6V  
= -5V  
GS  
-4  
4
V
GS  
V
= -4V  
GS  
0
0
0
-2  
V
-4  
-6  
-8  
-10  
0
-3  
-6  
-9  
-12  
-15  
, DRAIN TO SOURCE VOLTAGE (V)  
V
, GATE TO SOURCE VOLTAGE (V)  
DS  
GS  
FIGURE 5. SATURATION CHARACTERISTICS  
FIGURE 6. TRANSFER CHARACTERISTICS  
4-114  
RFD8P05, RFD8P05SM, RFP8P05  
Typical Performance Curves Unless Otherwise Specified  
3.0  
1.50  
1.25  
1.00  
0.75  
0.50  
0.25  
0
PULSE DURATION = 80µs  
DUTY CYCLE =0.5% MAX  
V
= V , I = -250µA  
DS  
GS  
D
2.5  
2.0  
1.5  
1.0  
V
= -10V, I = -8A  
GS  
D
0.5  
0
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
o
200  
o
T , JUNCTION TEMPERATURE ( C)  
J
T , JUNCTION TEMPERATURE ( C)  
J
FIGURE 7. NORMALIZED DRAIN TO SOURCE ON  
RESISTANCE vs JUNCTION TEMPERATURE  
FIGURE 8. NORMALIZED GATE THRESHOLD VOLTAGE vs  
JUNCTION TEMPERATURE  
1000  
2.0  
V
= 0V, f = 1MHz  
GS  
I
= -250µA  
D
C
C
C
= C  
+ C  
GD  
ISS  
GS  
= C  
RSS  
OSS  
GD  
800  
600  
400  
200  
0
C + C  
DS  
GS  
1.5  
1.0  
0.5  
0
C
ISS  
C
OSS  
C
RSS  
-15  
0
-5  
-10  
-20  
-25  
-50  
0
50  
100  
150  
200  
o
T , JUNCTION TEMPERATURE ( C)  
V
, DRAIN TO SOURCE VOLTAGE (V)  
DS  
J
FIGURE 9. NORMALIZED DRAIN TO SOURCE BREAKDOWN  
VOLTAGE vs JUNCTION TEMPERATURE  
FIGURE 10. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE  
-50  
-10  
GATE  
SOURCE  
VOLTAGE  
V
= BV  
DSS  
V
= BV  
DSS  
DD  
DD  
-37.5  
-25  
-8  
-6  
R
= 6.25Ω  
= 0.3mA  
L
I
G(REF)  
V
= 10V  
GS  
0.75BV  
0.50BV  
0.25BV  
DSS  
DSS  
DSS  
-12.5  
-4  
-2  
0
DRAIN TO SOURCE  
VOLTAGE  
0
I
I
I
I
G(REF)  
G(ACT)  
G(REF)  
20  
80  
TIME (µs)  
G(ACT)  
NOTE: Refer to Application Notes AN7254 and AN7260.  
FIGURE 11. NORMALIZED SWITCHING WAVEFORMS FOR CONSTANT GATE CURRENT  
4-115  
RFD8P05, RFD8P05SM, RFP8P05  
Test Circuits and Waveforms  
V
DS  
t
AV  
L
0
VARY t TO OBTAIN  
P
-
R
REQUIRED PEAK I  
G
AS  
V
DD  
+
DUT  
0V  
V
DD  
t
P
I
AS  
V
GS  
V
DS  
I
AS  
t
P
0.01Ω  
BV  
DSS  
FIGURE 12. UNCLAMPED ENERGY TEST CIRCUIT  
FIGURE 13. UNCLAMPED ENERGY WAVEFORMS  
t
t
ON  
OFF  
t
t
d(OFF)  
d(ON)  
t
t
f
r
0
10%  
10%  
R
L
DUT  
-
V
DS  
90%  
90%  
V
DD  
R
G
+
V
0
V
GS  
GS  
10%  
50%  
50%  
90%  
PULSE WIDTH  
FIGURE 14. SWITCHING TIME TEST CIRCUIT  
FIGURE 15. RESISTIVE SWITCHING WAVEFORMS  
V
V
DS  
DS  
Q
g(TH)  
R
L
0
V
= -1V  
-V  
GS  
V
= -5V  
V
GS  
GS  
GS  
-
V
DD  
Q
g(-5)  
+
V
= -10V  
GS  
V
DUT  
DD  
I
g(REF)  
Q
g(TOT)  
0
I
g(REF)  
FIGURE 16. GATE CHARGE TEST CIRCUIT  
FIGURE 17. GATE CHARGE WAVEFORMS  
4-116  
RFD8P05, RFD8P05SM, RFP8P05  
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.  
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-  
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and  
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result  
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.  
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com  
Sales Office Headquarters  
NORTH AMERICA  
EUROPE  
ASIA  
Intersil Corporation  
Intersil SA  
Mercure Center  
100, Rue de la Fusee  
1130 Brussels, Belgium  
TEL: (32) 2.724.2111  
FAX: (32) 2.724.22.05  
Intersil (Taiwan) Ltd.  
7F-6, No. 101 Fu Hsing North Road  
Taipei, Taiwan  
Republic of China  
TEL: (886) 2 2716 9310  
FAX: (886) 2 2715 3029  
P. O. Box 883, Mail Stop 53-204  
Melbourne, FL 32902  
TEL: (407) 724-7000  
FAX: (407) 724-7240  
4-117  
配单直通车
RFD8P05SM产品参数
型号:RFD8P05SM
是否Rohs认证: 不符合
生命周期:Obsolete
Reach Compliance Code:not_compliant
ECCN代码:EAR99
风险等级:5.74
其他特性:MEGAFET
外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:50 V
最大漏极电流 (Abs) (ID):8 A
最大漏极电流 (ID):8 A
最大漏源导通电阻:0.3 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AA
JESD-30 代码:R-PSSO-G2
JESD-609代码:e0
元件数量:1
端子数量:2
工作模式:ENHANCEMENT MODE
最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL
功耗环境最大值:48 W
最大功率耗散 (Abs):40 W
最大脉冲漏极电流 (IDM):20 A
认证状态:Not Qualified
子类别:Other Transistors
表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING
端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING
晶体管元件材料:SILICON
最大关闭时间(toff):100 ns
最大开启时间(吨):60 ns
Base Number Matches:1
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