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    AM29DL324GT70EI 参数 Datasheet PDF下载

    AM29DL324GT70EI图片预览
    型号： AM29DL324GT70EI
    PDF下载： 下载PDF文件 查看货源
    内容描述： 32兆位（ 4米×8位/ 2的M× 16位） CMOS 3.0伏只，同时操作闪存 [32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory]
    分类和应用： 闪存存储内存集成电路光电二极管
    文件页数/大小： 58 页 / 1293 K
    品牌： SPANSION [ SPANSION ]
     浏览型号AM29DL324GT70EI的Datasheet PDF文件第1页浏览型号AM29DL324GT70EI的Datasheet PDF文件第2页浏览型号AM29DL324GT70EI的Datasheet PDF文件第3页浏览型号AM29DL324GT70EI的Datasheet PDF文件第4页浏览型号AM29DL324GT70EI的Datasheet PDF文件第6页浏览型号AM29DL324GT70EI的Datasheet PDF文件第7页浏览型号AM29DL324GT70EI的Datasheet PDF文件第8页浏览型号AM29DL324GT70EI的Datasheet PDF文件第9页  
    D A T A
    S H E E T
    TABLE OF CONTENTS
    Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
    Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
    Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5
    Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
    Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
    Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
    Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10
    Table 1. Device Bus Operations ........................................................................................ 10
    Unlock Bypass Command Sequence ................................... 26
    Figure 3. Program Operation.............................................................................................. 26
    Chip Erase Command Sequence ............................................ 26
    Sector Erase Command Sequence ......................................... 27
    Erase Suspend/Erase Resume Commands ............................ 27
    Figure 4. Erase Operation................................................................................................... 28
    Table 14. Command Definitions......................................................................................... 29
    Write Operation Status . . . . . . . . . . . . . . . . . . . . 30
    DQ7: Data# Polling .................................................................. 30
    Figure 5. Data# Polling Algorithm....................................................................................... 30
    Word/Byte Configuration .......................................................... 10
    Requirements for Reading Array Data .....................................10
    Writing Commands/Command Sequences ..............................11
    Accelerated Program Operation ...........................................11
    Autoselect Functions .............................................................11
    Simultaneous Read/Write Operations
    with Zero Latency .....................................................................11
    Standby Mode .......................................................................... 11
    Automatic Sleep Mode .............................................................11
    RESET#: Hardware Reset Pin .................................................12
    Output Disable Mode ...............................................................12
    Table 2. Device Bank Divisions .......................................................................................... 12
    Table 3. Top Boot Sector Addresses ...............................................................................13
    Table 4. Top Boot Secured Silicon Sector Addresses .................................................... 14
    Table 5. Bottom Boot Sector Addresses ........................................................................... 15
    Table 6. Bottom Boot Secured Silicon Sector Addresses ............................................. 16
    RY/BY#: Ready/Busy# ..............................................................31
    DQ6: Toggle Bit I ..................................................................... 31
    Figure 6. Toggle Bit Algorithm............................................................................................. 31
    DQ2: Toggle Bit II .................................................................... 32
    Reading Toggle Bits DQ6/DQ2 ................................................ 32
    DQ5: Exceeded Timing Limits ................................................. 32
    DQ3: Sector Erase Timer ........................................................ 32
    Table 15. Write Operation Status .......................................................................................33
    Absolute Maximum Ratings . . . . . . . . . . . . . . . . 34
    Figure 7. Maximum Negative Overshoot Waveform....................................................... 34
    Figure 8. Maximum Positive Overshoot Waveform......................................................... 34
    DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
    Figure 9. I
    CC1
    Current vs. Time (Showing Active and Automatic Sleep Currents)...... 36
    Figure 10. Typical I
    CC1
    vs. Frequency................................................................................ 36
    Autoselect Mode ...................................................................... 17
    Table 7. Autoselect Codes, (High Voltage Method) ....................................................... 17
    Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 37
    Figure 11. Test Setup.......................................................................................................... 37
    Figure 12. Input Waveforms and Measurement Levels.................................................. 37
    Sector/Sector Block Protection and Unprotection .................... 18
    Table 8. Top Boot Sector/Sector Block Addresses for Protection/Unprotection .........18
    Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection ...18
    AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38
    Figure 13. Read Operation Timings................................................................................... 38
    Figure 14. Reset Timings..................................................................................................... 39
    Write Protect (WP#) .................................................................19
    Temporary Sector Unprotect ....................................................19
    Figure 1. Temporary Sector Unprotect Operation........................................................... 19
    Figure 2. In-System Sector Protection/
    Sector Unprotection Algorithms.......................................................................................... 20
    Word/Byte Configuration (BYTE#) ........................................... 40
    Figure 15. BYTE# Timings for Read Operations............................................................. 40
    Figure 16. BYTE# Timings for Write Operations.............................................................. 40
    Erase and Program Operations ............................................... 41
    Figure 17. Program Operation Timings............................................................................. 42
    Figure 18. Accelerated Program Timing Diagram........................................................... 42
    Figure 19. Chip/Sector Erase Operation Timings............................................................ 43
    Figure 20. Back-to-back Read/Write Cycle Timings........................................................ 44
    Figure 21. Data# Polling Timings (During Embedded Algorithms)............................... 44
    Figure 22. Toggle Bit Timings (During Embedded Algorithms)..................................... 45
    Figure 23. DQ2 vs. DQ6...................................................................................................... 45
    Secured Silicon Sector
    Flash Memory Region ..............................................................21
    Factory Locked: Secured Silicon Sector Programmed and Pro-
    tected At the Factory .............................................................21
    Customer Lockable: Secured Silicon Sector NOT Programmed
    or Protected At the Factory ...................................................21
    Hardware Data Protection ........................................................21
    Low VCC Write Inhibit ...........................................................22
    Write Pulse “Glitch” Protection ..............................................22
    Logical Inhibit ........................................................................22
    Power-Up Write Inhibit ..........................................................22
    Temporary Sector Unprotect ................................................... 46
    Figure 24. Temporary Sector Unprotect Timing Diagram.............................................. 46
    Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram...................... 47
    Alternate CE# Controlled Erase and Program Operations ...... 48
    Figure 26. Alternate CE# Controlled Write (Erase/Program) Operation Timings........ 49
    Common Flash Memory Interface (CFI) . . . . . . . 22
    Table 10. CFI Query Identification String..........................................................................
    Table 11. System Interface String......................................................................................
    Table 12. Device Geometry Definition...............................................................................
    Table 13. Primary Vendor-Specific Extended Query......................................................
    22
    23
    23
    24
    Command Definitions . . . . . . . . . . . . . . . . . . . . . . 24
    Reading Array Data ..................................................................24
    Reset Command ......................................................................25
    Autoselect Command Sequence ..............................................25
    Enter Secured Silicon Sector/Exit Secured Silicon Sector Com-
    mand Sequence .......................................................................25
    Byte/Word Program Command Sequence ...............................25
    Erase And Programming Performance . . . . . . .
    Latchup Characteristics . . . . . . . . . . . . . . . . . . . .
    TSOP Pin and Fine-Pitch BGA Capacitance. . . .
    Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . .
    Physical Dimensions . . . . . . . . . . . . . . . . . . . . . .
    50
    50
    50
    50
    51
    FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA)
    8 x 14 mm ................................................................................ 51
    FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm ..................... 52
    TS 048—Thin Small Outline Package ..................................... 53
    Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 55
    December 4, 2006 25686B10
    Am29DL32xG
    3

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